Small yet powerful, semiconductor chips play an integral role as “master controllers” that enable modern technological marvels such as as laptops, game consoles, smartphones and more. With 1.15 trillion semiconductor units shipped globally in 20211 - equivalent to about 140 semiconductor chips shipped for every person on Earth2, semiconductor production is undeniably critical. Manufactured in special cleanroom environments, they require strict monitoring of dust and particles to prevent contamination that could affect yield rates.
Keeping pace with Moore’s Law, which states that the number of transistors in an integrated circuit (IC) would double about every two years, the entire chain of semiconductor or wafer manufacturing processes is set to rise in complexity, with machines and related semiconductor equipment becoming increasingly sophisticated.
- Wafers are sliced and polished from the raw silicon ingot forms
- Conducting materials are then deposited in a thin layer
- A thin layer of photoresist (light sensitive coating) is applied onto the wafer
- Wafer is then rapidly spun through a spin coating sub-process to spread the photoresist evenly across its surface due to centrifugal force
- Ultraviolet light (deep or extreme ultraviolet) is projected onto the wafer
- Enable design of the integrated circuit (“master blueprint”) to be printed on the photoresist layer
- Advanced technology allows increasing number of transistors to be packed within the limited space
- Carefully controlled process of removing the photoresist
- Add conductive features into the blueprint
- Increasingly complex process for 3D NAND manufacturers
- Scaling density and capacity up to 1,000 layers remains a challenge for 3D NAND manufacturers3
- Wafer is exposed to either positive or negative ions, or impurities
- A common method used to enable conductivity to the blueprint
- Remaining areas, where the resist is proteced from the impurity implantation, are removed at this step
- Usually the final step of manufacturing
- Protects delicate semiconductor components
- Ensures electrical connections and facilitates heat dissipation
- A protective shielding from moisture and mechanical stress to “wrap” the important chipset within
Semiconductor Ecosystem
An active player in the machine builders and equipment makers (OEM) market, LAPP constantly innovates by utilising its cable and connectivity know-how to help its customers tackle and overcome challenges.
Catering to the unique needs of customers, the Harnessing Solutions teams focus on the investigation of new concepts, providing feasibility for the customers. From start to finish, LAPP partners with customers through every phase and builds a comprehensive understanding of the final product’s requirements to successfully launch, manufacture, and scale.
Semiconductor Manufacturing
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2. Calculation based on 8.2 billion world population. https://www.worldometers.info/world-population/
3. https://www.semiconductor-digest.com/how-etch-breakthroughs-are-tackling-3d-nand-scaling-challenges-on-the-path-to-1000-layers/